IPhone X

This page is a work in progress.

With the release of the iPhone X, we saw the beginning of a new standard of motherboard design by Apple. The iPhone X implemented a "stacked" motherboard that reduces the overall surface area in order to increase efficiency and make room for other components, including an increase to the battery size. In essence, it is like two separate motherboards have been soldered together around a perimeter. This innovative change in design has garnered much praise and has allowed for new techniques to be developed for both motherboard diagnosis and data recovery. However, it has also some glaring weaknesses. Most notably, the iPhone X is prone to broken solder pads between these two connected motherboards, which can cause a variety of problems.